Direct integration of photovoltaic device into circuit board

ABSTRACT

Aspects relate to a system and a method of operating an integrated device is provided. The method includes providing a circuit board that includes one or more on-board electronic components and an upper surface configured as a substrate, providing photovoltaic device layers that include at least a semi-conductor absorber layer, a buffer layer, and a top electrode layer on the upper surface of the circuit board that form a photovoltaic device using the upper surface of the circuit board as a photovoltaic device substrate, wherein the buffer layer is integrally deposited between the semi-conductor absorber layer and the top electrode, generating electricity using the photovoltaic device, and powering one or more of the on-board electronic components using the electricity from the photovoltaic device.

BACKGROUND

The present disclosure relates generally to a photovoltaic device, andmore specifically, to a method and system for including a photovoltaicdevice on a circuit board.

There is a growing need for wide-scale deployment of sensors or circuitswhich contain a portable power source so that they can be deployed “offthe grid” in a standalone fashion without requiring a direct connectionto a power source via a wired connection. Such portable applications arecurrently implemented using an in-device portable power supply. In somecases this power supply is a battery or supercapacitor while in othercases the device may include a solar cell that provides power.

Some companies already offer products (sensors and circuits) that arepowered by a completed solar cell that is “plugged in” to the sensor orcircuit. However, providing an accompanying solar cell that connects toa device that is to be powered is costly due to added complexity,material needs, and space requirements. For example, a significantfraction of the cost of a thin film solar cell is the glass substrate.The costs of providing this glass substrate can account for as much as50% of the overall cost of the solar cell alone. Further, additionalhousing and mounting hardware that is used to encompass the additionalpower source device within the portable device drives up the overallcosts.

SUMMARY

According to one embodiment a method of operating an integrated deviceis provided. The method includes providing a circuit board that includesone or more on-board electronic components and an upper surfaceconfigured as a substrate, providing photovoltaic device layers thatinclude at least a semi-conductor absorber layer, a buffer layer, and atop electrode layer on the upper surface of the circuit board that forma photovoltaic device using the upper surface of the circuit board as aphotovoltaic device substrate, wherein the buffer layer is integrallydeposited between the semi-conductor absorber layer and the topelectrode, generating electricity using the photovoltaic device, andpowering one or more of the on-board electronic components using theelectricity from the photovoltaic device.

In addition to one or more of the features described above, or as analternative, further embodiments may include providing an on-boardenergy storage device.

In addition to one or more of the features described above, or as analternative, further embodiments may include connecting the on-boardenergy storage device between the photovoltaic device and the one ormore on-board electronic components.

In addition to one or more of the features described above, or as analternative, further embodiments may include storing the generatedelectricity from the photovoltaic device in the on-board energy storagedevice.

In addition to one or more of the features described above, or as analternative, further embodiments may include providing storedelectricity to the one or more on-board electronic components.

In addition to one or more of the features described above, or as analternative, further embodiments may include providing a secondphotovoltaic device on the upper surface of the circuit board.

In addition to one or more of the features described above, or as analternative, further embodiments may include providing additionalelectricity generated by the second photovoltaic device to one or moreon-board electronic components by connecting the second photovoltaicdevice in series or parallel with the photovoltaic device.

According to another embodiment a system for operating an integrateddevice is provided. The system includes a memory having computerreadable instructions, and one or more processors for executing thecomputer readable instructions, the computer readable instructionsincluding providing a circuit board that includes one or more on-boardelectronic components and an upper surface configured as a substrate,providing photovoltaic device layers that include at least asemi-conductor absorber layer, a buffer layer, and a top electrode layeron the upper surface of the circuit board that form a photovoltaicdevice using the upper surface of the circuit board as a photovoltaicdevice substrate, wherein the buffer layer is integrally depositedbetween the semi-conductor absorber layer and the top electrode,generating electricity using the photovoltaic device, and powering oneor more of the on-board electronic components using the electricity fromthe photovoltaic device.

In addition to one or more of the features described above, or as analternative, further embodiments may include additional computerreadable instructions including providing an on-board energy storagedevice.

In addition to one or more of the features described above, or as analternative, further embodiments may include additional computerreadable instructions including connecting the on-board energy storagedevice between the photovoltaic device and the one or more on-boardelectronic components.

In addition to one or more of the features described above, or as analternative, further embodiments may include including additionalcomputer readable instructions including storing the generatedelectricity from the photovoltaic device in the on-board energy storagedevice.

In addition to one or more of the features described above, or as analternative, further embodiments may include additional computerreadable instructions including providing stored electricity to the oneor more on-board electronic components.

In addition to one or more of the features described above, or as analternative, further embodiments may include additional computerreadable instructions including providing a second photovoltaic deviceon the upper surface of the circuit board.

In addition to one or more of the features described above, or as analternative, further embodiments may include additional computerreadable instructions including providing additional electricitygenerated by the second photovoltaic device to one or more on-boardelectronic components by connecting the second photovoltaic device inseries or parallel with the photovoltaic device.

According to another embodiment, a computer program product foroperating an integrated device is provided. The computer program productincluding a computer readable storage medium having program instructionsembodied therewith. The program instructions executable by a processorto cause the processor to provide a circuit board that includes one ormore on-board electronic components and an upper surface configured as asubstrate, provide photovoltaic device layers that include at least asemi-conductor absorber layer, a buffer layer, and a top electrode layeron the upper surface of the circuit board that form a photovoltaicdevice using the upper surface of the circuit board as a photovoltaicdevice substrate, wherein the buffer layer is integrally depositedbetween the semi-conductor absorber layer and the top electrode,generate electricity using the photovoltaic device, and power one ormore of the on-board electronic components using the electricity fromthe photovoltaic device.

In addition to one or more of the features described above, or as analternative, further embodiments may include additional computerreadable instructions including providing an on-board energy storagedevice.

In addition to one or more of the features described above, or as analternative, further embodiments may include additional computerreadable instructions including connecting the on-board energy storagedevice between the photovoltaic device and the one or more on-boardelectronic components.

In addition to one or more of the features described above, or as analternative, further embodiments may include additional computerreadable instructions including storing the generated electricity fromthe photovoltaic device in the on-board energy storage device.

In addition to one or more of the features described above, or as analternative, further embodiments may include additional computerreadable instructions including providing stored electricity to the oneor more on-board electronic components.

In addition to one or more of the features described above, or as analternative, further embodiments may include additional computerreadable instructions including providing a second photovoltaic deviceon the upper surface of the circuit board, and providing additionalelectricity generated by the second photovoltaic device to one or moreon-board electronic components by connecting the second photovoltaicdevice in series or parallel with the photovoltaic device.

Additional features and advantages are realized through the techniquesof the present invention. Other embodiments and aspects of the inventionare described in detail herein and are considered a part of the claimedinvention. For a better understanding of the invention with theadvantages and the features, refer to the description and to thedrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter which is regarded as the invention is particularlypointed out and distinctly claimed in the claims at the conclusion ofthe specification. The forgoing and other features, and advantages ofthe invention are apparent from the following detailed description takenin conjunction with the accompanying drawings in which:

FIG. 1 depicts a block diagram of an electronic computing device inaccordance with some embodiments of this disclosure;

FIG. 2 depicts an electronic computing device sub-component inaccordance with some embodiments of this disclosure;

FIG. 3A depicts an integrated system including a circuit board andphotovoltaic device in accordance with some embodiments of thisdisclosure;

FIG. 3B depicts a an integrated system including a circuit board andmultiple photovoltaic devices in accordance with some embodiments ofthis disclosure;

FIG. 4A depicts an integrated system including a circuit board andphotovoltaic device in accordance with some embodiments of thisdisclosure;

FIG. 4B depicts an integrated system including a circuit board andmultiple photovoltaic devices in accordance with some embodiments ofthis disclosure;

FIG. 5A is a cross-sectional view along A-A, as shown in FIG. 3A,depicting the layers of a photovoltaic device and connectors inaccordance with some embodiments of this disclosure;

FIG. 5B is a cross-sectional view along B-B, as shown in FIG. 3B,depicting the layers of multiple photovoltaic devices and connectors inaccordance with some embodiments of this disclosure;

FIG. 6 is a cross-sectional view of an integrated system depicting thelayers of a photovoltaic device in accordance with some embodiments ofthis disclosure;

FIG. 7 is a cross-sectional view of an integrated system depictinglayers in a photovoltaic device and an on-board energy storage device inaccordance with some embodiments of this disclosure;

FIG. 8A depicts a circuit board with a large cavity in accordance withsome embodiments of this disclosure;

FIG. 8B depicts a circuit board with a large cavity within which aphotovoltaic device is placed in accordance with some embodiments ofthis disclosure;

FIG. 9 depicts a process flow of a method of manufacturing an integrateddevice in accordance with some embodiments of this disclosure; and

FIG. 10 depicts a process flow of a method of operating an integrateddevice in accordance with some embodiments of this disclosure.

DETAILED DESCRIPTION

One or more embodiments described herein are directed to a method,apparatus, and system that eliminate the need for a separate individualsubstrate for each photovoltaic element and instead directly andmonolithically integrate the photovoltaic device directly into or ontothe circuit board or sensor/chip using the circuit board or sensor/chipas the substrate. Accordingly, the photovoltaic device is integrateddirectly onto a circuit board and powers a portable sensor or microchipor subcomponent thereof. This could provide significant cost savingsgiven that the substrate is effectively free because the circuit boardis used as the substrate. Further, a thin film battery could alsooptionally be added to allow the device to operate in the absence ofsunlight.

Turning now to FIG. 1, an electronic computing device 100, which mayalso be called a computer system 100, that includes a plurality ofelectronic computing device sub-components is generally shown inaccordance with one or more embodiments. Particularly, FIG. 1illustrates a block diagram of a computer system 100 (hereafter“computer 100”) for use in practicing the embodiments described herein.The methods described herein can be implemented in hardware, software(e.g., firmware), or a combination thereof. In an exemplary embodiment,the methods described herein are implemented in hardware, and may bepart of the microprocessor of a special or general-purpose digitalcomputer, such as a personal computer, workstation, minicomputer, ormainframe computer. Computer 100 therefore can embody a general-purposecomputer. In another exemplary embodiment, the methods described hereinare implemented as part of a mobile device, such as, for example, amobile phone, a personal data assistant (PDA), a tablet computer, etc.

In an exemplary embodiment, in terms of hardware architecture, as shownin FIG. 1, the computer 100 includes processor 101. Computer 100 alsoincludes memory 102 coupled to processor 101, and one or more inputand/or output (I/O) adaptors 103, that may be communicatively coupledvia a local system bus 105. Communications adaptor 104 may operativelyconnect computer 100 to one or more networks 111. System bus 105 mayalso connect one or more user interfaces via interface adaptor 112.Interface adaptor 112 may connect a plurality of user interfaces tocomputer 100 including, for example, keyboard 109, mouse 110, speaker113, etc. System bus 105 may also connect display adaptor 116 anddisplay 117 to processor 101. Processor 101 may also be operativelyconnected to graphical processing unit 118.

Further, the computer 100 may also include a sensor 119 that isoperatively connected to one or more of the other electronicsub-components of the computer 100 through the system bus 105. Thesensor 119 can be an integrated or a standalone sensor that is separatefrom the computer 100 and may be communicatively connected using a wireor may communicate with the computer 100 using wireless transmissions.

Processor 101 is a hardware device for executing hardware instructionsor software, particularly that stored in a non-transitorycomputer-readable memory (e.g., memory 102). Processor 101 can be anycustom made or commercially available processor, a central processingunit (CPU), a plurality of CPUs, for example, CPU 101 a-101 c, anauxiliary processor among several other processors associated with thecomputer 100, a semiconductor based microprocessor (in the form of amicrochip or chip set), a macroprocessor, or generally any device forexecuting instructions. Processor 101 can include a memory cache 106,which may include, but is not limited to, an instruction cache to speedup executable instruction fetch, a data cache to speed up data fetch andstore, and a translation lookaside buffer (TLB) used to speed upvirtual-to-physical address translation for both executable instructionsand data. The cache 106 may be organized as a hierarchy of more cachelevels (L1, L2, etc.).

Memory 102 can include random access memory (RAM) 107 and read onlymemory (ROM) 108. RAM 107 can be any one or combination of volatilememory elements (e.g., DRAM, SRAM, SDRAM, etc.). ROM 108 can include anyone or more nonvolatile memory elements (e.g., erasable programmableread only memory (EPROM), flash memory, electronically erasableprogrammable read only memory (EEPROM), programmable read only memory(PROM), tape, compact disc read only memory (CD-ROM), disk, cartridge,cassette or the like, etc.). Moreover, memory 102 may incorporateelectronic, magnetic, optical, and/or other types of non-transitorycomputer-readable storage media. Note that memory 102 can have adistributed architecture, where various components are situated remotefrom one another, but can be accessed by the processor 101.

The instructions in memory 102 may include one or more separateprograms, each of which comprises an ordered listing ofcomputer-executable instructions for implementing logical functions. Inthe example of FIG. 1, the instructions in memory 102 may include asuitable operating system 113. Operating system 113 can control theexecution of other computer programs and provides scheduling,input-output control, file and data management, memory management, andcommunication control and related services.

Input/output adaptor 103 can be, but not limited to, one or more busesor other wired or wireless connections, as is known in the art. Theinput/output adaptor 103 may have additional elements, which are omittedfor simplicity, such as controllers, buffers (caches), drivers,repeaters, and receivers, to enable communications. Further, the localinterface may include address, control, and/or data connections toenable appropriate communications among the aforementioned components.

Interface adaptor 112 may be configured to operatively connect one ormore I/O devices to computer 100. For example, interface adaptor 112 mayconnect a conventional keyboard 109 and mouse 110. Other output devices,speaker 113, for example, may be operatively connected to interfaceadaptor 112. Other output devices may also be included, although notshown. For example, devices may include but are not limited to aprinter, a scanner, microphone, and/or the like. Finally, the I/Odevices connectable to interface adaptor 112 may further include devicesthat communicate both inputs and outputs, for instance but not limitedto, a network interface card (MC) or modulator/demodulator (foraccessing other files, devices, systems, or a network), a radiofrequency (RF) or other transceiver, a telephonic interface, a bridge, arouter, and the like.

Computer 100 can further include display adaptor 116 coupled to one ormore displays 117. In an exemplary embodiment, computer 100 can furtherinclude communications adaptor 104 for coupling to a network 111.

Network 111 can be an IP-based network for communication betweencomputer 100 and any external device. Network 111 transmits and receivesdata between computer 100 and external systems. In an exemplaryembodiment, network 111 can be a managed IP network administered by aservice provider. Network 111 may be implemented in a wireless fashion,e.g., using wireless protocols and technologies, such as WiFi, WiMax,etc. Network 111 can also be a packet-switched network such as a localarea network, wide area network, metropolitan area network, Internetnetwork, or other similar type of network environment. The network 111may be a fixed wireless network, a wireless local area network (LAN), awireless wide area network (WAN) a personal area network (PAN), avirtual private network (VPN), intranet or other suitable networksystem.

If computer 100 is a PC, workstation, laptop, tablet computer and/or thelike, the instructions in the memory 102 may further include a basicinput output system (BIOS) (omitted for simplicity). The BIOS is a setof essential routines that initialize and test hardware at startup,start operating system 113, and support the transfer of data among theoperatively connected hardware devices. The BIOS is stored in ROM 108 sothat the BIOS can be executed when computer 100 is activated. Whencomputer 100 is in operation, processor 101 may be configured to executeinstructions stored within the memory 102, to communicate data to andfrom the memory 102, and to generally control operations of the computer100 pursuant to the instructions.

According to one or more embodiments, any one of the electroniccomputing device sub-components of the computer 100 includes a circuitboard that requires a power source. Accordingly, a photovoltaic devicemay be integrated on the circuit boards of any of the electroniccomputing device sub-components to locally provide power to devices onthe circuit boards. For example, the sensor 119 can include a circuitboard on which a photovoltaic device can be integrally formed therebyproviding a localized power source directly on the circuit board forpowering elements of the circuit board. This localized power supplyallows the sensor 119 to operate as a standalone electronic computerdevice sub-component.

For example, turning now to FIG. 2, an electronic computing devicesub-component 200 is shown in accordance with some embodiments of thisdisclosure. The electronic computing device sub-component 200 can be anyone of the electronic computing device sub-components of the computer100 as shown in FIG. 1. As shown, the electronic computing devicesub-component 200 includes at least one circuit board 220 and aphotovoltaic device 210 that is integrally deposited on the circuitboard 220. The circuit board 220 also includes wires and/or traces 230that connect individual on-board electronic components 240 on thecircuit board 220 to each other and to the photovoltaic device 210.Thus, the photovoltaic device 210 can provide generated power to theon-board electronic components 240 on the circuit board 220.

Turning now to FIG. 3A, an integrated system 300A including a circuitboard 320A and photovoltaic device 310A is shown in accordance with someembodiments of this disclosure. In this embodiment, the circuit board320A includes an upper surface upon which the photovoltaic device 310Ais deposited. The upper surface of the circuit board 320A is planarizedto provide a flat even surface upon which the layers of the photovoltaicdevice 310A can be accurately deposited. For example, in accordance withone embodiment, planarization of the upper surface of the circuit board320A includes making the surface entirely flat (i.e. filling in theholes of the board and/or removing protrusions from the surface) priorto depositing the photovoltaic device 310A (which ultimately would stickup from the surface by a couple of hundred nm or a few microns).

According to another embodiment, the upper surface of the circuit board320A may also include a barrier layer. The barrier layer, e.g.spin-on-glass, is placed onto the circuit board 320A prior to formingthe photovoltaic device 310A layers like the electrodes, absorbers, etc.This barrier layer can provide a covering for when the laminate surfaceof the circuit board 320A requires being covered over with somethinginert.

As shown, the photovoltaic device 310A can be provided such that itcovers a large portion of the circuit board 320A without extending tothe edges of the circuit board 320A. According to other embodiments,parameters such as the shape, size, location, and number of photovoltaicdevices can be adjusted based on the desired power required byelectronic devices on the circuit board. The parameters can also beadjusted based on the shape, size, design, and arrangement of electronicdevices on the circuit board. The parameters can also be adjusted basedon the properties of the circuit board itself.

For example, turning now to FIG. 3B, an integrated system 300B,including a circuit board 320B and multiple photovoltaic devices 310B,330B, is shown in accordance with some embodiments of this disclosure. Afirst photovoltaic device 310B is provided that can be configured topower an individual or subset of electronic components on the circuitboard 320B. Similarly, the second photovoltaic device 330B is providedon the circuit board 320B to power a subset of desired electroniccomponents. Alternatively, the photovoltaic devices 310B, 330B may beconnected in series or in parallel to provide a combined power toelectronic components on the circuit board 320B in accordance withparameters of the electronic components and circuit board 320B. Asshown, the photovoltaic devices 310B and 330B are of similar size andshape and are arranged symmetrically on the circuit board 320B. Inanother embodiment, multiple photovoltaic devices provided on a circuitboard can be of different sizes and shape and deposited anywhere on theupper surface of the circuit board.

Turning now to FIG. 4A, an integrated system 400A, including a circuitboard 420A and photovoltaic device 410A, is shown in accordance withsome embodiments of this disclosure. In this embodiment, the circuitboard 420A includes an upper surface upon which the photovoltaic device410A is deposited. The upper surface of the circuit board 420A isplanarized, at least in part, to provide a flat even surface within adepressed portion. The layers of the photovoltaic device 410A are thenaccurately deposited within the depressed portion of the upper surfacethat is planarized. This depressed portion, which can also be called acavity or indented region, can be provided with a depth that is equal tothe overall height of the photovoltaic device 410A that is deposited inthe cavity. Accordingly, the resulting overall integrated system 400Awould be totally flat. As shown, the photovoltaic device 410A can beprovided such that it covers a large portion of the circuit board 420Aextending to multiple edges of the circuit board 420A. According toother embodiments, parameters such as the shape, size, location, andnumber of photovoltaic devices can be adjusted based on the desiredpower required by electronic devices on the circuit board. Theparameters can also be adjusted based on the shape, size, design, andarrangement of electronic devices on the circuit board. The parameterscan also be adjusted based on the properties of the circuit board itselfsuch as the size, depth, and placement of the cavity within which thephotovoltaic device 410A is deposited.

For example, as shown in FIG. 4B, an integrated system 400B including acircuit board 420B and multiple photovoltaic devices 410B, 430B, and440B, is shown in accordance with some embodiments of this disclosure. Afirst photovoltaic device 410B is provided that can be configured topower an individual or subset of electronic components on the circuitboard 420B. Similarly, a second photovoltaic device 430B and a thirdphotovoltaic device 440B are provided on the circuit board 420B to powera subset of desired electronic components. Alternatively, thephotovoltaic devices 410B, 430B, 440B can be connected in series or inparallel to provide a combined power to electronic components on thecircuit board 420B in accordance with parameters of the electroniccomponents and circuit board 420B. As shown, the photovoltaic devices410B and 430B are of similar size and shape and are arrangedsymmetrically within depressed regions on the circuit board 420B. Incontrast, the photovoltaic device 440B is deposited on a flat portion ofthe upper surface. In another embodiment, multiple photovoltaic devicesprovided on a circuit board can be of different sizes and shape anddeposited anywhere on the upper surface of the circuit board.

In accordance with one or more embodiments of this disclosure, FIG. 5Ashows a cross-sectional view along an axis A-A as shown in FIG. 3A, thatdepicts layers of a photovoltaic device 510A and connectors 521A, 522Aof an integrated system 500A. The photovoltaic device 510A includes abottom electrode 511A that is integrally deposited on the upper surfaceof the circuit board 520A. By depositing the first layer of thephotovoltaic device 510A, specifically the bottom electrode 511A,directly onto the circuit board 520A, and the upper surface of thecircuit board serves as the substrate for the photovoltaic device 510A,thereby not requiring a separate substrate. The photovoltaic device 510Aalso includes a semi-conductor absorber layer 512A, a buffer layer 513A,and a top electrode 514A. The semi-conductor absorber layer 512A canspecifically be a photovoltaic absorber that is deposited on the bottomelectrode 511A. According to one or more additional embodiments, thesemi-conductor absorber layer 512A can be either a combination ofsemi-conductor layers or a single semi-conductor layer with p- andn-type materials mixed in. The buffer layer 513A is deposited on thesemi-conductor absorber layer 512A and the top electrode 514A isdeposited on the buffer layer 513A. The bottom electrode 511A isconnected to a positive connector junction 521A of the circuit board520A, which provides a connection to one or more on-board electroniccomponents. Similarly, the top electrode 514A is connected to a negativeconnector junction 522A of the circuit board 520A, which provides aconnection to the one or more on-board electronic components.Accordingly, through these connections the photovoltaic device 510A canprovide power to on-board electronic components on the circuit board520A.

According to another exemplary embodiment the photovoltaic device 510Aincludes the four layers as shown wherein the layers are a bottomelectrode 511A, a p-type semiconductor 512A, an n-type semiconductor513A, and a top electrode 514A, where the top electrode 514A istransparent.

Turning now to FIG. 5B, a cross-sectional view along B-B, as shown inFIG. 3B, is shown depicting the layers of multiple photovoltaic devicesand connectors of an integrated system 500B in accordance with someembodiments of this disclosure. Particularly, the integrated system 500Bincludes a first photovoltaic device 510B and a second photovoltaicdevice 530B that are connected in parallel to a positive connectorjunction 521B and a negative connector junction 522B.

Specifically, the first photovoltaic device 510B includes a bottomelectrode 511B that is integrally deposited on the upper surface of thecircuit board 520B. By depositing the first layer of the firstphotovoltaic device 510B, the bottom electrode 511B, directly onto thecircuit board 520B, and the upper surface of the circuit board serves asthe substrate for the first photovoltaic device 510B, thereby notrequiring a separate substrate. The first photovoltaic device 510B alsoincludes a semi-conductor absorber layer 512B, a buffer layer 513B, anda top electrode 514B. The semi-conductor absorber layer 512B canspecifically be a photovoltaic absorber that is deposited on the bottomelectrode 511B. According to one or more additional embodiments, thesemi-conductor absorber layer 512B can be either a combination ofsemi-conductor layers or a single semi-conductor layer with p- andn-type materials mixed in. The buffer layer 513B is deposited on thesemi-conductor absorber layer 512B and the top electrode 514B isdeposited on the buffer layer 513B. According to another exemplaryembodiment the photovoltaic device 510B includes the four layers asshown wherein the layers are the bottom electrode 511B, a p-typesemiconductor 512B, an n-type semiconductor 513B, and the top electrode514B, where the top electrode 514B is transparent. The bottom electrode511B is connected to a positive connector junction 521B of the circuitboard 520B, which provides a connection to one or more on-boardelectronic components. Similarly, the top electrode 514B is connected toa negative connector junction 522B of the circuit board 520B, whichprovides a connection to the one or more on-board electronic components.Accordingly, through these connections the first photovoltaic device510B can provide power to on-board electronic components on the circuitboard 520B.

Similarly, the second photovoltaic device 530B includes a bottomelectrode 531B that is integrally deposited on the upper surface of thecircuit board 520B. By depositing the first layer of the secondphotovoltaic device 530B, the bottom electrode 531B, directly onto thecircuit board 520B, and the upper surface of the circuit board serves asthe substrate for the second photovoltaic device 530B, thereby notrequiring a separate substrate. The second photovoltaic device 530B alsoincludes a semi-conductor absorber layer 532B, a buffer layer 533B, anda top electrode 534B. The semi-conductor absorber layer 532B canspecifically be a photovoltaic absorber that is deposited on the bottomelectrode 531B. The buffer layer 533B is deposited on the semi-conductorabsorber layer 532B, and the top electrode 534B is deposited on thebuffer layer 533B. The bottom electrode 531B is connected in parallelwith the first photovoltaic device 510B to the positive connectorjunction 521B of the circuit board 520B, which provides a connection toone or more on-board electronic components. Similarly, the top electrode534B is connected in parallel with the first photovoltaic device 510B tothe negative connector junction 522B of the circuit board 520B, whichprovides a connection to the one or more on-board electronic components.Accordingly, through these connections the second photovoltaic device530B can provide power to on-board electronic components on the circuitboard 520B along with the first photovoltaic device 510B. According toanother embodiment, the first and second photovoltaic devices can beconnected in series, or when more photovoltaic devices are provided, acombination of series, parallel, and individual connections to on-boardelectronic components can be provided.

In accordance with other embodiments, different photovoltaic devices canbe provided with differing levels of complexity and layers. For example,turning now to FIG. 6, a cross-sectional view of an integrated systemdepicting the layers of a photovoltaic device 610 is shown in accordancewith another embodiment of this disclosure. Particularly, as shown, theintegrated device 600 includes a circuit board 620 and the photovoltaicdevice 610 deposited on the integrated device 600. In this embodimentthe photovoltaic device 610 contains a first electrode 611, a secondelectrode 613, and a single semi-conductor layer 612 deposited betweenthe first and second electrodes 611, 613. For example, thisconfiguration where there are only three layers 611, 612, 613 is mainlyapplicable in an organic photovoltaic where p- and n-type materials areactually mixed into the single semi-conductor layer 612, which can alsobe called a single active layer 612. Other embodiments may be providedthat contain additional layers provided between these layers thatprovide additional functionality and/or benefits. For example, aphotovoltaic device may also include a protective glass layer depositedon the top electrode.

In accordance with other embodiments, an on-board energy storage device730 can be provided. For example, turning now to FIG. 7, across-sectional view of an integrated system 700 depicting layers in aphotovoltaic device 710 and an on-board energy storage device 730 isshown in accordance with some embodiments of this disclosure. Theintegrated system 700 includes a circuit board 720 on which thephotovoltaic device 710 is integrally disposed and on which the on-boardenergy storage device 730 is provided. The photovoltaic device 710includes a first electrode 711, a second electrode 713, and asemi-conductor absorber layer 712 placed between the electrodes 711,713. The first and second electrodes 711, 713 are electrically connectedto the on-board energy storage device 730. The on-board energy storagedevice 730 includes initial input positive and negative connectors 731,732 that connect to the photovoltaic device 710 which provides generatedpower to the on-board energy storage device 730 for storage. Theon-board energy storage device 730 also includes output positive andnegative connectors 733, 734 that provide stored power to electroniccomponents in the circuit board 720.

Turning now to FIG. 8A, a circuit board 820A with a large cavity 801A isshown in accordance with some embodiments of this disclosure. Thecircuit board 820A also includes positive and negative connector 812A,822A that are placed so as to connect with a photovoltaic device. Thecavity 801A is provided such that the floor of the cavity is planarizedso that a photovoltaic device can be directly deposited using thesurface as a substrate. For example, turning now to FIG. 8B, a circuitboard 820B includes a large cavity within which a photovoltaic device810B is deposited is shown in accordance with some embodiments of thisdisclosure. The photovoltaic device includes a first bottom electrode811B, a semi-conductor absorber layer 812B, and a second top electrode813B. The bottom electrode 811B connects to positive connector 822B andthe top electrode connects to negative connector 821B. The depositedlayers are created such that the electrodes 811B, 813B not only line upwith the connectors 822B, 821B but also so that the overall photovoltaicdevice 810B is flush with the remaining portion of the circuit board820B.

Turning now to FIG. 9, a process flow of a method of manufacturing anintegrated device is shown in accordance with some embodiments of thisdisclosure. The method includes providing a circuit board (operation905) and configuring an upper surface of the circuit board as asubstrate (operation 910). Further, the method includes integrallydepositing photovoltaic device layers on the upper surface of thecircuit board to form a photovoltaic device using the upper surface ofthe circuit board as a photovoltaic device substrate (operation 915).Then the method includes electrically connecting the photovoltaic deviceto one or more on-board electronic components (operation 920).

Turning now to FIG. 10, a process flow of a method of operating anintegrated device is shown in accordance with some embodiments of thisdisclosure. The method includes providing a circuit board that includesone or more on-board electronic components and an upper surfaceconfigured as a substrate (operation 1005). The method also includesproviding photovoltaic device layers on the upper surface of the circuitboard that form a photovoltaic device using the upper surface of thecircuit board as a photovoltaic device substrate (operation 1010). Themethod then generates electricity using the photovoltaic device(operation 1015). Finally, the method powers one or more of the on-boardelectronic components using the electricity from the photovoltaic device(operation 1020).

According to another embodiment, the method may further includeintegrally connecting the one or more on-board electronic components tothe circuit board before integrally depositing the photovoltaic devicelayers. Integrally depositing photovoltaic device layers is done at amaximum process temperature that is less than a component degradationtemperature of the one or more on-board electronic components. Further,according to one embodiment, the component degradation temperature is200 Celsius.

According to another embodiment, the method may further includeintegrally connecting the one or more on-board electronic components tothe circuit board after integrally depositing the photovoltaic devicelayers. Integrally depositing photovoltaic device layers is done at amaximum process temperature that is thus independent of the componentdegradation temperature of the one or more on-board electroniccomponents (which are not yet on-board) and less than a circuit boarddegradation temperature. According to one embodiment, the circuit boarddegradation temperature is based on a glass transition temperature of aresin in the circuit board. For example, the glass transitiontemperature of the circuit board may be 200-400 Celsius. According toother embodiments the component degradation temperature may be anothervalue.

According to another embodiment, the method may further includeplanarizing the circuit board. Specifically, configuring the uppersurface of the circuit board as the substrate may include planarizingthe circuit board by removing bumps and filing holes in the uppersurface. According to another embodiment, the method may further includecoating the circuit board. For example, configuring the upper surface ofthe circuit board as the substrate may include coating the circuit boardwith a diffusion barrier that separates impurities in the circuit boardfrom the photovoltaic device. According to another embodiment, themethod may further include coating the top electrode with a metalcontact grid and increasing stability of the device by encapsulating thedevice.

According to another embodiment, the method may further includemodifying the surface of the circuit board (e.g. with spin-on-glass oranother material) to improve the morphology of the layers to besubsequently deposited onto the board. For example, if the subsequentlayers are to be processed from solutions, then the wettability of theboard could impact the morphology of subsequent layers deposited on top.Surface-modification techniques performed on the planarized circuitboard could thus be used to enhance the properties of the subsequentlayers in the device.

Technical effects and benefits of some embodiments include reducedmaterial cost by eliminating the need to provide a separate substratefor each photovoltaic device. Additional housing materials and wiringmaterials that would normally hold the separate photovoltaic device andthe device that the photovoltaic device is used to power are eliminatedby directly integrating the photovoltaic device onto the device circuitboard. Accordingly, devices can be made with less material and fewerelements, and be structurally integrated together, providing a compactapparatus. Further, multiple photovoltaic devices can be includedwithout expanding the device footprint.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising”, when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescription of the present invention has been presented for purposes ofillustration and description, but is not intended to be exhaustive orlimited to the invention in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the artwithout departing from the scope and spirit of the invention. Theembodiments were chosen and described in order to best explain theprinciples of the invention and the practical application, and to enableothers of ordinary skill in the art to understand the invention forvarious embodiments with various modifications as are suited to theparticular use contemplated.

The present invention may be a system, a method, and/or a computerprogram product at any possible technical detail level of integration.The computer program product may include a computer readable storagemedium (or media) having computer readable program instructions thereonfor causing a processor to carry out aspects of the present invention.

The computer readable storage medium can be a tangible device that canretain and store instructions for use by an instruction executiondevice. The computer readable storage medium may be, for example, but isnot limited to, an electronic storage device, a magnetic storage device,an optical storage device, an electromagnetic storage device, asemiconductor storage device, or any suitable combination of theforegoing. A non-exhaustive list of more specific examples of thecomputer readable storage medium includes the following: a portablecomputer diskette, a hard disk, a random access memory (RAM), aread-only memory (ROM), an erasable programmable read-only memory (EPROMor Flash memory), a static random access memory (SRAM), a portablecompact disc read-only memory (CD-ROM), a digital versatile disk (DVD),a memory stick, a floppy disk, a mechanically encoded device such aspunch-cards or raised structures in a groove having instructionsrecorded thereon, and any suitable combination of the foregoing. Acomputer readable storage medium, as used herein, is not to be construedas being transitory signals per se, such as radio waves or other freelypropagating electromagnetic waves, electromagnetic waves propagatingthrough a waveguide or other transmission media (e.g., light pulsespassing through a fiber-optic cable), or electrical signals transmittedthrough a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network may comprisecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device.

Computer readable program instructions for carrying out operations ofthe present invention may be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, configuration data for integrated circuitry, oreither source code or object code written in any combination of one ormore programming languages, including an object oriented programminglanguage such as Java, Smalltalk, C++, or the like, and conventionalprocedural programming languages, such as the “C” programming languageor similar programming languages. The computer readable programinstructions may execute entirely on the user's computer, partly on theuser's computer, as a standalone software package, partly on the user'scomputer and partly on a remote computer or entirely on the remotecomputer or server. In the latter scenario, the remote computer may beconnected to the user's computer through any type of network, includinga local area network (LAN) or a wide area network (WAN), or theconnection may be made to an external computer (for example, through theInternet using an Internet Service Provider). In some embodiments,electronic circuitry including, for example, programmable logiccircuitry, field-programmable gate arrays (FPGA), or programmable logicarrays (PLA) may execute the computer readable program instructions byutilizing state information of the computer readable programinstructions to personalize the electronic circuitry, in order toperform aspects of the present invention.

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions.

These computer readable program instructions may be provided to aprocessor of a general purpose computer, special purpose computer, orother programmable data processing apparatus to produce a machine, suchthat the instructions, which execute via the processor of the computeror other programmable data processing apparatus, create means forimplementing the functions/acts specified in the flowchart and/or blockdiagram block or blocks. These computer readable program instructionsmay also be stored in a computer readable storage medium that can directa computer, a programmable data processing apparatus, and/or otherdevices to function in a particular manner, such that the computerreadable storage medium having instructions stored therein comprises anarticle of manufacture including instructions which implement aspects ofthe function/act specified in the flowchart and/or block diagram blockor blocks.

The computer readable program instructions may also be loaded onto acomputer, other programmable data processing apparatus, or other deviceto cause a series of operational steps to be performed on the computer,other programmable apparatus or other device to produce a computerimplemented process, such that the instructions which execute on thecomputer, other programmable apparatus, or other device implement thefunctions/acts specified in the flowchart and/or block diagram block orblocks.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and computer program products according to variousembodiments of the present invention. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof instructions, which comprises one or more executable instructions forimplementing the specified logical function(s). In some alternativeimplementations, the functions noted in the blocks may occur out of theorder noted in the Figures. For example, two blocks shown in successionmay, in fact, be executed substantially concurrently, or the blocks maysometimes be executed in the reverse order, depending upon thefunctionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts or carry out combinations of special purpose hardwareand computer instructions.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed:
 1. A method of operating an integrated device, themethod comprising: providing a circuit board that includes one or moreon-board electronic components and an upper surface configured as asubstrate; providing photovoltaic device layers that include at least asemi-conductor absorber layer, a buffer layer, and a top electrode layeron the upper surface of the circuit board that form a photovoltaicdevice using the upper surface of the circuit board as a photovoltaicdevice substrate, wherein the buffer layer is integrally depositedbetween the semi-conductor absorber layer and the top electrode;generating electricity using the photovoltaic device; and powering oneor more of the on-board electronic components using the electricity fromthe photovoltaic device.
 2. The method of claim 1, further comprising:providing an on-board energy storage device.
 3. The method of claim 2,further comprising: connecting the on-board energy storage devicebetween the photovoltaic device and the one or more on-board electroniccomponents.
 4. The method of claim 3, further comprising: storing thegenerated electricity from the photovoltaic device in the on-boardenergy storage device.
 5. The method of claim 4, further comprising:providing stored electricity to the one or more on-board electroniccomponents.
 6. The method of claim 1, further comprising: providing asecond photovoltaic device on the upper surface of the circuit board. 7.The method of claim 6, further comprising: providing additionalelectricity generated by the second photovoltaic device to one or moreon-board electronic components by connecting the second photovoltaicdevice in series or parallel with the photovoltaic device.
 8. A systemfor operating an integrated device, the system comprising: anon-transitory computer-readable medium storing computer readableinstructions; and one or more processors for executing the computerreadable instructions to perform a method, comprising: providing acircuit board that includes one or more on-board electronic componentsand an upper surface configured as a substrate; providing photovoltaicdevice layers that include at least a semi-conductor absorber layer, abuffer layer, and a top electrode layer on the upper surface of thecircuit board that form a photovoltaic device using the upper surface ofthe circuit board as a photovoltaic device substrate, wherein the bufferlayer is integrally deposited between the semi-conductor absorber layerand the top electrode; generating electricity using the photovoltaicdevice; and powering one or more of the on-board electronic componentsusing the electricity from the photovoltaic device.
 9. The system ofclaim 8, wherein the one or more processors additionally performproviding an on-board energy storage device.
 10. The system of claim 9,wherein the one or more processors additionally perform connecting theon-board energy storage device between the photovoltaic device and theone or more on-board electronic components.
 11. The system of claim 10,wherein the one or more processors additionally perform storing thegenerated electricity from the photovoltaic device in the on-boardenergy storage device.
 12. The system of claim 11, wherein the one ormore processors additionally perform providing stored electricity to theone or more on-board electronic components.
 13. The system of claim 8,wherein the one or more processors additionally perform providing asecond photovoltaic device on the upper surface of the circuit board.14. The system of claim 13, wherein the one or more processorsadditionally perform providing additional electricity generated by thesecond photovoltaic device to one or more on-board electronic componentsby connecting the second photovoltaic device in series or parallel withthe photovoltaic device.
 15. A non-transitory computer program productfor operating an integrated device, the non-transitory computer programproduct comprising program instructions executable by a processor toperform a method, comprising: providing a circuit board that includesone or more on-board electronic components and an upper surfaceconfigured as a substrate; providing photovoltaic device layers thatinclude at least a semi-conductor absorber layer, a buffer layer, and atop electrode layer on the upper surface of the circuit board that forma photovoltaic device using the upper surface of the circuit board as aphotovoltaic device substrate, wherein the buffer layer is integrallydeposited between the semi-conductor absorber layer and the topelectrode; providing electricity using the photovoltaic device; andpowering one or more of the on-board electronic components using theelectricity from the photovoltaic device.
 16. The non-transitorycomputer program product of claim 15, wherein the method additionallyincludes providing an on-board energy storage device.
 17. Thenon-transitory computer program product of claim 16, wherein the methodadditionally includes connecting the on-board energy storage devicebetween the photovoltaic device and the one or more on-board electroniccomponents.
 18. The non-transitory computer program product of claim 17,wherein the method additionally includes storing the generatedelectricity from the photovoltaic device in the on-board energy storagedevice.
 19. The non-transitory computer program product of claim 18,wherein the method additionally includes providing stored electricity tothe one or more on-board electronic components.
 20. The non-transitorycomputer program product of claim 15, wherein the method additionallyincludes providing a second photovoltaic device on the upper surface ofthe circuit board; and providing additional electricity generated by thesecond photovoltaic device to one or more on-board electronic componentsby connecting the second photovoltaic device in series or parallel withthe photovoltaic device.